Advanced Flexible Materials (ADFLEMA)
NAMICS’ ADFLEMA offers a comprehensive suite of solutions tailored to address the diverse needs of modern electronic applications.
Advanced Flexible Materials (ADFLEMA)
NAMICS’ ADFLEMA offers a comprehensive suite of solutions tailored to address the diverse needs of modern electronic applications.
ADFLEMA serves as an insulating adhesive film for heat dissipation substrates and power modules, embedded applications such as resistors, capacitors, and inductors, as well as antennas, RF modules, and wireless communication systems, where signal integrity is paramount.
Low dielectric constant and low dissipation factor efficiently minimize dielectric losses, thereby significantly reducing transmission losses, particularly in high-frequency bands and maintains signal strength and integrity.
ADFLEMA serves as an insulating adhesive film for heat dissipation substrates and power modules, embedded applications such as resistors, capacitors and inductors, as well as antennas, RF modules, and wireless communication systems, where signal integrity is paramount.
Low dielectric constant and low dissipation factor efficiently minimize dielectric losses, thereby significantly reducing transmission losses, particularly in high-frequency bands and maintains signal strength and integrity.
ADFLEMA’s high flow and low-pressure film make it well-suited for embedded applications.
Its compatibility with embedding processes facilitates the seamless integration of passive components, like resistors, capacitors, and inductors, directly into substrates. This capability streamlines design processes, enabling compact and space-efficient electronic systems while ensuring robust mechanical properties and stable operation over extended periods.
Low CTE & High Tg
Unmatched Bump Protection
High Flow with
Low Pressure
Well-suited for embedded applications
Void-free
Excellent flow allows a
void-free seal
ADFLEMA’s high flow and low-pressure film make it well-suited for embedded applications.
Its compatibility with embedding processes facilitates the seamless integration of passive components, like resistors, capacitors, and inductors, directly into substrates. This capability streamlines design processes, enabling compact and space-efficient electronic systems while ensuring robust mechanical properties and stable operation over extended periods.
Low CTE & High Tg
Unmatched Bump Protection
High Flow with
Low Pressure
Well-suited for embedded applications
Void-free
Excellent flow allows a
void-free seal
Low Dielectric Adhesive Film typical applications
- High-frequency antenna cables
- Antenna modules
- Millimeter waver radar antennas
high thermal conductivity insulating film applications
- Substrate for headlights
- Substrate for heads-up display and power modules
Insulating embedding film typical applications:
- PCBs with built-in components
- High-definition compact modules
Low Dielectric Adhesive Film typical applications
- High-frequency antenna cables
- Antenna modules
- Millimeter waver radar antennas
high thermal conductivity insulating film applications
- Substrate for headlights
- Substrate for heads-up display and power modules
Insulating embedding film typical applications:
- PCBs with built-in components
- High-definition compact modules
Download our Product Guide
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Download our Product Guide
Please complete the form to get an instant download of our sales sheet on ADFLEMA materials.