Board Level Underfill (BLUF)
Designed to meet rigorous automotive reliability requirements, these high Tg materials can withstand high operating temperatures, which is critical in protecting solder connections from shock, drop, and vibration.
Glob Top & Encapsulants
NAMICS’ encapsulant materials are designed to provide unmatched reliability performance in the harshest of automotive environments, offering excellent moisture protection and heat resistance. These high Tg materials meet the REACH and RoHS requirements.
Pressure and Pressureless Silver Sintering
Outstanding thermal performance and high reliability that is critical for automotive applications. These materials are used in components such as power modules and inverters, meeting the stringent automotive and environment requirements.