Board Level Underfills
NAMICS is the world’s leading supplier of underfills for a diverse number of applications.
Board Level Underfills
NAMICS is the world’s leading supplier of underfills for a diverse number of applications.
Our latest Board Level Underfills (BLUF) are designed to meet both current and future applications, are formulated for today’s packaging designs and comply with REACH 2022 requirements.
The current trends for CSPs and BGAs are moving towards finer pitch designs due to increase in I/O (input and output) count causing solder joints to decrease in size. The decreased size in the solder balls makes them more susceptible to failure during drop, shock and thermal cycle testing.
Our latest Board Level Underfills (BLUF) are designed to meet both current and future applications, are formulated for today’s packaging designs and comply with REACH 2022 requirements.
The current trends for CSPs and BGAs are moving towards finer pitch designs due to increase in I/O (input and output) count causing solder joints to decrease in size. The decreased size in the solder balls makes them more susceptible to failure during drop, shock and thermal cycle testing.
Our Board Level Underfills are highly Reliable and Reworkable
NAMICS’ Reworkable Board Level Underfill ensures high reliability through temperature cycling, environmental testing and drop testing to meet stringent automotive standards. It can be easily reworked with no residue or solder mask damage. This material offers high volume throughput with fast flow at room temperature and quick curing.
Low CTE & High Tg
Unmatched Bump Protection
Snap Cure & Fast Capillary Flow
Easily fills gaps less than 200 μm
Green Materials
REACH Compliant™, Does not contain CMR materials, including HHPA and MHHPA
Our Board Level Underfills are highly Reliable and Reworkable
NAMICS’ Reworkable Board Level Underfill ensures high reliability through temperature cycling, environmental testing and drop testing to meet stringent automotive standards. It can be easily reworked with no residue or solder mask damage. This material offers high volume throughput with fast flow at room temperature and quick curing.
Low CTE & High Tg
Unmatched Bump Protection
Snap Cure & Fast Capillary Flow
Easily fills gaps less than 200 μm
Green Materials
REACH Compliant™, Does not contain CMR materials, including HHPA and MHHPA
Ideal for high volume production
- Snap cure
- Fast flow
- Needle or jet dispensable
Meets rigerous automotive requirements
- Protects sensitive solder connection from shock, drop, and vibration
- High Tg above 150°C to withstand high operating temperatures
Reworkable version with outstanding reliability
- High filler loading to meet demanding applications
- Room temperature flow
Ideal for high volume production
- Snap cure
- Fast flow
- Needle or jet dispensable
Meets rigerous automotive requirements
- Protects sensitive solder connection from shock, drop, and vibration
- High Tg above 150°C to withstand high operating temperatures
Reworkable version with outstanding reliability
- High filler loading to meet demanding applications
- Room temperature flow
Download our Product Guide
Please complete the form to get an instant download of our Product Guide on Board Level Underfills (BLUFs).
Download our Product Guide
Please complete the form to get an instant download of our Product Guide on Board Level Underfills (BLUFs).