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Board Level Underfills

Board Level Underfills

Where things go bump, nobody protects you better than NAMICS.

NAMICS is the world’s leading supplier of underfills for a diverse number of applications.  The current trends for CSPs and BGAs are moving towards finer pitch designs due to increase in I/O (input and output) count causing solder joints to decrease in size.  The decreased size in the solder balls makes them more susceptible to failure during drop, shock and thermal cycle testing.  To meet these challenges, a new generation of board level underfills is needed that offers reliability performance similar to packaging level underfills, with the manufacturability of current board level materials such as fast flow and curing.

NAMICS latest board level underfills are formulated for today’s packaging designs and comply with REACH 2022 requirements.  The result is an innovative board level underfill designed to meet both current and future applications.  

Resources

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High Volume Production

Ideal for high volume production

  • Snap cure
  • Fast flow
  • Needle or jet dispensable

Proven Reliability

Capable of meeting rigorous automotive reliability requirement

  • Protects sensitive solder connections from shock, drop and vibration
  • High Tg (above 150C) provides the ability to withstand high operating temperatures

Green Material

Novel resin meets stringent Green Requirements

  • Meets EU REACH 2022 Annex XIV requirements
  • Does not contain HHPA or MHHPA

High Reliability, Reworkable Board Level Underfill

NAMICS’ Reworkable Board Level Underfill ensures high reliability through temperature cycling, environmental testing and drop testing to meet stringent automotive standards. It can be easily reworked with no residue or solder mask damage. This material offers high volume throughput with fast flow at room temperature and quick curing.

Typical Properties

SUF1575-9SUF1570-2SUF1589-24SUF1594-1
Low Temp Cure**
Fast Cure****
High Reliability**
Room Temp Flow*
Reworkable*
REACH 2022 GREEN****
Viscosity3.5 Pa–sec40.0 Pa-sec3.0 Pa-sec0.7 Pa-sec
Tg100135C170C105C
CTE50 ppm32 ppm25 ppm60 ppm
Bending Modulus5.0 GPa8.0 GPa10.0 GPa4.0 GPa

Want to learn more about our Board Level Underfill (BLUF)?

Board Level Underfill (BLUF) Sales Sheet