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Upcoming Events

NAMICS Upcoming 2021 Conference Presentations

NAMICS has been a leader in the semiconductor adhesive industry for over 75 years. Our adhesives have been used in a variety of settings, including in automotive systems. We will be sharing our expert advice in advanced materials for automotive applications at two upcoming events. Read on to learn more about these events and how you can register for our talks.

April 2021 Talk (Online)
“Advanced Materials for Automotive System-in-Package (SiP) Applications”

Event: 17th Annual Device Packaging Conference (DPC 2021)

Conference Date: April 12-15, 2021

Location: Online (will be available on demand for 30 days)

Where to Register for this Event: https://www.imaps.org/device_packaging_conference.php

About DPC 2021: DPC 2021 is an online, global event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The conference unites industry and academia to exchange knowledge regarding microelectronics manufacture and packaging. People who will benefit from this conference include scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.

Topic of NAMICS talk: Advanced Materials for Automotive SiP Applications.  NAMICS will be discussing our latest innovative materials for SiP (System-in-Package) applications for the automotive market.  System in Package (SiP) technology combines multiple advanced packaging technologies to create a customized solution with higher performance, in a cost-effective fashion, to meet growing demand for automobile electronic systems.

July 2021 Talk (Detroit, MI, USA)
“Functional Materials for Automotive Applications”

Event: Automotive Plastics & Advanced Composites 2021 Exhibition and Conference

Conference Date: July 29-30, 2021

Location: Crowne Plaza Detroit Downtown Riverfront Hotel, Detroit, Michigan, USA

NAMICS Talk Date and Time: Thursday, July 29th, 3:30 PM – 4:00 PM

Where to Register for this Event: https://www.automotive-plastics-composites.com/

About 2021 Automotive Plastics and Advanced Composites Conference: Advanced materials developers meet with leading automotive manufacturers in Detroit, Michigan to explore the latest innovations in plastics and advanced composites for the automotive industry.

Topic of NAMICS talk: Introduction of stretchable functional pastes for interior automotive application.  NAMICS will be introducing our new, stretchable and functional pastes designed for automotive interiors. We make functional inks that can be used to add electrical functionality for plastic surfaces. Our products help create smart surfaces for use in cars, trucks, SUVs, and other automobile applications, either on flexible substrates or used for in-mold electronic (IME) applications.

Save 20% on registration by using our promo code SPKCODE

NAMICS stretchable inks for IME (In-Mold Electronics)

As technology evolves, so does the need for components that can facilitate innovation. With today’s focus on smart surfaces, advanced techniques and materials are what makes it all possible. Printed electronics make such advances possible, eliminating the need for large, bulky, multi-part circuitry, but the benefits don’t stop there.

In-Mold Electronics (IMEs) are 70 percent lighter than conventionally-manufactured electronics. Since there are no buttons and wires, the potential for breakage is significantly decreased, making IME parts more durable.

In addition to a 30 percent reduction in production costs, manufacturers enjoy a shorter assembly time and an almost infinite number of new design possibilities for applications that include automotive, medical, appliances, wearables, smart home consumer technology, and much more besides. 

Benefits of Stretchable Inks

In the area of stretchable inks for IME applications, NAMICS is leading the way. Our superior functional inks offer leading class stretch performance that outshines our competitor’s versions.

Compared to competitor’s inks, NAMICS inks showed minimal resistance change after forming, with no noticeable cracks or deformation. With excellent adhesion and compatibility to polycarbonate substrates, our functional inks are designed for standard printing equipment with quick drying times and are capable of deep drawing and forming configurations that results in a high manufacturing output.

Other benefits include:

  • Parts are lightweight and efficient, featuring up to 90 percent less depth and 80 percent less weight
  • Highly durable
  • Easy to update production processes, both cosmetic and electrical
  • Mass-production ready, ideal for high-speed manufacturing equipment

Industry-Leading Innovation

Far from a new player in this space, NAMICS has been innovating for more than 70 years. Our new line of functional inks is designed for smart technology, providing a way to make the next generation of smart surfaces possible.

Our stretchable inks include both silver and carbon-based conductive inks and dielectric inks suitable for a range of electronic applications, giving designers and engineers a platform to ideate and bring new products to market quickly, setting the standard for future innovation.

Leading Class Stretch Performance

With the growing demand for smarter, more compact, affordable, and portable tech, stretchable inks are fast becoming an essential manufacturing tool.

As an industry leader in this area, NAMICS continues to outperform, providing companies with the technology they need to push the boundaries of innovation and open up new possibilities that, even in recent times, have been unattainable due to cost, durability, and reliability concerns.

Our stretchable inks include:

  • Silver (Ag) conductive inks, XE181 series, offering high electrical conductivity to create the necessary electrical connections
  • Carbon-based conductive inks, XE182 series, that can be used to protect Ag conductive inks in highly moisture-resistant environments, or to create simple PTC (Positive Temperature Control) heaters with low voltage
  • Dielectric inks, XE185 series, that feature a uniform, pinhole-free layer with high insulation, allowing crossover layers or insulating Ag conductive ink layers

NAMICS also offers a Conductive Bonding Adhesive, H9230 series, for bonding rigid components to the interconnects.

To learn more about NAMICS, stretchable inks, and how we can become your innovation partner, reach out today.

 

NAMICS Technologies Inc.

  • 226 Airport Parkway, Suite 660 San Jose, CA 95110 USA
  • +1-408-516-4611
  • sales@namics-usa.com

NAMICS Corporation

  • 3993 Nigorikawa, Kita-ku, Niigata City, Niigata Prefecture 950-3131
  • +81-25-258-5577
  • sales@namics-usa.com