Commitment to Achieve Carbon Neutrality by 2050
We are pleased to announce our commitment to achieving carbon neutrality by 2050.
Through our business activities—including product research and development, manufacturing, and sales—we strive to reduce environmental impact and improve energy efficiency.
Guided by our corporate philosophy of “Mutual prosperity to both nature and mankind through creativity, innovation and sensitivity,” we remain committed to fulfilling our social responsibilities.
Moving forward, we will implement effective and phased measures such as the introduction of renewable energy, promotion of energy-saving practices, and reduction of emissions across the supply chain. Together with our stakeholders, we will continue to advance toward the realization of a sustainable future.
our products
ADFLEMA (advanced flexible materials)
NAMICS’ ADFLEMA offers a comprehensive suite of solutions tailored to address the diverse needs of modern electronic applications.
Board Level Underfill (BLUF)
Designed to meet stringent requirements while re-workable for excellent reliability
Camera Module Adhesives
Our adhesives ensure optimal protection, effective heat dissipation, and robust bonding for a wide array of electronic components.
Capillary Underfill for Wafer Level Package (WLP)
Narrow gap flow with low warpage and bump protection. Compatible with copper pillar
Glob Top & Encapsulants
Outstanding adhesion to a wide variety of substrates, low CTE and high modulus for unmatched strength and robustness
Liquid Compression Molded Underfill (LCMUF)
Capable of wafer and panel level packaging, while highly productive due to fast cure cycle with minimal warpage after molding cure
Low temperature pressure-less sintering
NAMICS’ semiconductor packaging technology protects the die, connects the chip to a board or other chips, and may dissipate heat.
Low temperature Solder Glass Preforms
NAMICS’ semiconductor packaging technology protects the die, connects the chip to a board or other chips, and may dissipate heat.
Pressure sintering
From low-temperature sintering, to high-reliability and excellent printability, this material is a top choice for those who demand the best in die attach technology.