Board Level Underfill (BLUF)
Designed to meet rigorous automotive reliability requirements, these high Tg materials can withstand high operating temperatures, which is critical in protecting solder connections from shock, drop, and vibration.
Glob Top & Encapsulants
NAMICS’ encapsulant materials are designed to provide unmatched reliability performance in the harshest of automotive environments, offering excellent moisture protection and heat resistance. These high Tg materials meet the REACH and RoHS requirements.
Camera Module Adhesives
NAMICS’ adhesives for camera modules are designed for the fast and accurate alignment of fixed-focus and auto-focus camera modules. With flexible cure options and high dimensional stability, our products offer unmatched reliability for critical applications.
