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Corner Bond

Corner Bond

NAMICS’ Corner Bond materials provide an alternative to the complete underfill process. The material is dispensed to all four corners of the CSP/BGA to reinforce components and improve reliability. Corner bonding is a simplified manufacturing process for CSP/BGA, and eliminates the capillary flow time while providing more reliability than unreinforced bumps.

Features of corner bond materials are:

  • Simplified process with no capillary underfill flow time
  • Low dispensing volume for an economical solution to BGA/CSP reinforcement
  • High throughput with a fast cure system
  • No void issue