NAMICS glob top material and encapsulants are designed to provide an electrical insulating material for both environmental protection and enhance the mechanical robustness for fragile semiconductor devices and components as well as wire bond packages. These highly filled, high purity materials offer exceptional moisture protection and unmatched performance for most demanding applications. Designed for high speed manufacturing operations offering quick curing profiles and easy dispensing through either needle dispense or jet dispensing.
NAMICS encapsulants are used as a glob top encapsulation by dispensing a precise volume of material on the component with controlled flow over target area
NAMICS encapsulants can be used in a dam & fill encapsulation using a two-step process.
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