Glob Top Material & Encapsulants
Glob Top Material & Encapsulants
NAMICS glob top material and encapsulants are designed to provide electrical insulation for environmental protection, and to enhance the mechanical robustness for fragile semiconductor devices and components as well as wire bond packages. These highly-filled, high-purity materials offer exceptional moisture protection and unmatched performance for the most demanding applications. Designed for high speed manufacturing operations, these materials offer quick curing profiles and easy dispensing through either needle or jet dispensing.
- Outstanding adhesion to a wide variety of substrates
- Offers low CTE and high modulus for unmatched strength and robustness
- High moisture and heat resistance
- Designed for high reliability and harsh environment applications
- Superior moisture resistance
- High bias voltage to protect critical components
- Meets REACH and RoHS requirements
NAMICS’ encapsulants are used in a glob top encapsulation by dispensing a precise volume of material on the component with controlled flow over target area.
NAMICS’ encapsulants can be used in a dam & fill encapsulation using a two-step process.
- Dam material is designed around perimeter to build a wall
- Fill material is dispensed inside the dam to complete the encapsulation.
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