NAMICS glob top material and encapsulants are designed to provide electrical insulation for environmental protection, and to enhance the mechanical robustness for fragile semiconductor devices and components as well as wire bond packages. These highly-filled, high-purity materials offer exceptional moisture protection and unmatched performance for the most demanding applications. Designed for high speed manufacturing operations, these materials offer quick curing profiles and easy dispensing through either needle or jet dispensing.
NAMICS’ encapsulants are used in a glob top encapsulation by dispensing a precise volume of material on the component with controlled flow over target area.
NAMICS’ encapsulants can be used in a dam & fill encapsulation using a two-step process.
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