At the heart of every breakthrough company is a visionary—someone who dares to push boundaries, question the status quo, and redefine what’s possible. For Diemat, Inc., that visionary was Raymond Louis Dietz.

 

Born and raised in Bradford, Illinois, Ray Dietz spent more than 40 years shaping the electronic materials industry. A graduate of the University of Illinois with a degree in materials science, he held over 30 patents and pioneered cutting-edge adhesive and sealing materials that helped advance the electronics packaging industry. But to those who knew him, Ray was more than a brilliant scientist—he was a passionate innovator, devoted family man, and deeply spiritual individual.

 

In 1988, Ray founded Diemat, Inc. in Byfield, Massachusetts—just 30 miles north of Boston. With a strong foundation in materials science and engineering, Diemat quickly earned a reputation for excellence in developing and manufacturing high-performance adhesive and sealing products tailored for the electronic packaging industry. Ray’s leadership emphasized the importance of innovation, which became the company’s driving philosophy: only products with novel, patentable qualities made it to market.

 

Diemat was staffed with experts in Chemical Engineering, Polymer Chemistry, Materials Science, and Semiconductors, and together they built a portfolio of truly unique products unmatched in the industry. One of Diemat’s early breakthroughs was a lower temperature Ag-loaded glass adhesive for die attachment—offering both traditional and lead-free versions. Over the years, Diemat expanded its offerings to include thermally conductive adhesives with extraordinary thermal performance, as well as specialized solutions for hermetically sealing optical fibers and electronic packages.

 

In the late 1990s, Diemat developed a pioneering solder-glass sealing process for optoelectronics, reducing manufacturing costs and eliminating the need for expensive soldering processes. By 2010, the company introduced the SK-series of thermal adhesives, utilizing a novel silver filler technology to achieve thermal conductivities of over 60 W/m•K—a significant leap in performance for thermal interface materials.

 

In early 2008, Diemat’s innovation and reputation attracted the attention of NAMICS Corporation, a global leader in insulating and conductive materials. Diemat was acquired and became part of NAMICS’ worldwide network of research and development, further amplifying Ray’s impact on the global stage. In 2013, Diemat was officially designated the NAMICS North American R&D Center, continuing its mission to push the boundaries of materials science and electronic packaging.

 

Ray remained a senior advisor until his passing in July 2015, working on next-generation materials with the same passion and commitment that defined his life’s work. While Ray is no longer with us, his legacy lives on in every innovation Diemat developed—and in the continued work of the NAMICS R&D Center.

 

At the core of Diemat’s charter is a simple but powerful belief: that innovation drives progress. By focusing on the development of state-of-the-art products that deliver superior performance and lower costs, Ray Dietz helped shape the future of electronics manufacturing—and left an indelible mark on everyone who had the privilege to work with him.