If you manufacture electronics, we should talk

corner bond


NAMICS Corner Bond provides an alternative to complete underfill process. The material is dispensed to all four corners of the CSP/BGA to reinforce component and improve reliability. Corner bonded provides a simplified manufacturing process for CSP/BGA, eliminating the capillary flow time and providing more reliability than unreinforced bumps.

Features of corner bond materials are:

  • Simplified process with no capillary underfill flow process
  • Low dispensing volume for an economical solution to BGA/CSP reinforcement
  • High throughput with fast cure system
  • No void issue

NAMICS Technologies Inc.

  • 226 Airport Parkway, Suite 660 San Jose, CA 95110 USA
  • +1-408-516-4611
  • sales@namics-usa.com

NAMICS Corporation

  • 3993 Nigorikawa, Kita-ku, Niigata City, Niigata Prefecture 950-3131
  • +81-25-258-5577
  • sales@namics-usa.com