If you manufacture electronics, we should talk

liquid molding compounds

NAMICS Liquid Compression Molding (LCM) material is an encapsulation material applied at the wafer level, offering high reliability and minimal warpage after curing.

Low warpage

  • Suitable for reflow and grinding after PMC process.

Narrow Gap Flow

  • Suitable for low profile packages.

High productivity

  • NAMNICSÂ’ LCM allows higher productivity than current LCM thanks to its faster curing speed, resulting in increased UPH (Units Per Hour) at molding process.

NAMICS Technologies Inc.

  • 226 Airport Parkway, Suite 660 San Jose, CA 95110 USA
  • +1-408-516-4611
  • sales@namics-usa.com

NAMICS Corporation

  • 3993 Nigorikawa, Kita-ku, Niigata City, Niigata Prefecture 950-3131
  • +81-25-258-5577
  • sales@namics-usa.com