Liquid Compression Molded Underfill
Liquid Compression Molded Underfill (LCMUF)
NAMICS’ Liquid Compression Mold Underfill (LCMUF) is an advanced liquid molding technology that offers a simplified process compared to standard capillary underfill methods. It is designed to fill small gaps with high flow, thanks to the utilization of fine filler technology, and overmold the semiconductor package in one single step.
Resources
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Simplified Process
Comparison of the manufacturing process of LCMUF to CUF
High flow into small gaps and outstanding filling properties
Ability to flow into gaps down to 20 um
– No Flow Marks!
Low Warpage on Wafer
Proprietary resin system combined with high filler loading for low CTE results in lower stress and low warpage on wafer
Liquid Mold Adhesive Properties
Want to learn more about our Liquid Compression Molded Underfill (LCMUF)?
Contact us for more information!