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Liquid Compression Molded Underfill

Liquid Compression Molded Underfill (LCMUF)

NAMICS’ Liquid Compression Mold Underfill (LCMUF) is an advanced liquid molding technology that offers a simplified process compared to standard capillary underfill methods. It is designed to fill small gaps with high flow, thanks to the utilization of fine filler technology, and overmold the semiconductor package in one single step.

Resources

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Simplified Process

Comparison of the manufacturing process of LCMUF to CUF

High flow into small gaps and outstanding filling properties

Ability to flow into gaps down to 20 um

– No Flow Marks!

Low Warpage on Wafer

Proprietary resin system combined with high filler loading for low CTE results in lower stress and low warpage on wafer

Liquid Mold Adhesive Properties

Want to learn more about our Liquid Compression Molded Underfill (LCMUF)?
Click below to download our sales sheet with more information.

Download LCMUF Sales Sheet