Liquid Compression
Mold Underfills
NAMICS is the world’s leading supplier of underfills for a diverse number of applications.
Liquid Compression Mold Underfills
NAMICS is the world’s leading supplier of underfills for a diverse number of applications.
NAMICS’ Liquid Compression Mold Underfill (LCMUF) is an advanced liquid molding technology that offers a simplified process when compared to standard capillary underfill methods.
It is designed to fill small gaps with high flow and to overmold the semiconductor package in a single step. Traditional capillary underfill methods rely on the capillary action to draw the liquid underfill material into the gaps, which can be a complex and time-consuming process. In contrast, LCMUF simplifies the underfill process by utilizing a liquid compression molding technique
NAMICS’ Liquid Compression Mold Underfill (LCMUF) is an advanced liquid molding technology that offers a simplified process when compared to standard capillary underfill methods.
It is designed to fill small gaps with high flow and to overmold the semiconductor package in a single step. Traditional capillary underfill methods rely on the capillary action to draw the liquid underfill material into the gaps, which can be a complex and time-consuming process. In contrast, LCMUF simplifies the underfill process by utilizing a liquid compression molding technique
Our Liquid Compression Mold Underfills (LCMUF) are time-saving and reliable.
NAMICS’ Liquid Compression Mold Underfill (LCMUF) is an advanced liquid molding technology that offers a simplified process compared to standard capillary underfill methods. It is designed to fill small gaps with high flow, thanks to the utilization of fine filler technology, and overmold the semiconductor package in one single step.
Low CTE
Unmatched Bump Protection
High Flow
Ability to flow into gaps down to 20 um
Low Warpage
Flexible epoxy technology
Our Liquid Compression Mold Underfills (LCMUF) are time-saving and reliable.
NAMICS’ Liquid Compression Mold Underfill (LCMUF) is an advanced liquid molding technology that offers a simplified process compared to standard capillary underfill methods. It is designed to fill small gaps with high flow, thanks to the utilization of fine filler technology, and overmold the semiconductor package in one single step.
Low CTE & High Tg
Unmatched Bump Protection
High Flow
Ability to flow into gaps down to 20 um
Low Warpage
Flexible epoxy technology
Ideal for high volume production
- Single-step process of underfill and overmold
- 70% reduction of process time per wafer
Uniform narrow gap flow
- Utilizes a fine filler system to flow into fine gaps and pitches
- No filler clogging due to optimized particle distribution
Unmatched control of wafer warpage
- Utilizes a flexible resin system and elastomers for low modulus
- High filler content for low CTE
Ideal for high volume production
- Single-step process of underfill and overmold
- 70% reduction of process time per wafer
Uniform narrow gap flow
- Utilizes a fine filler system to flow into fine gaps and pitches
- No filler clogging due to optimized particle distribution
Unmatched control of wafer warpage
- Utilizes a flexible resin system and elastomers for low modulus
- High filler content for low CTE
Download our Product Guide
Please complete the form to get an instant download of our sales sheet on Liquid Compression Molded Underfills.
Download our Product Guide
Please complete the form to get an instant download of our sales sheet on Liquid Compression Molded Underfills.