With the demand for high-powered electronics rapidly increasing, there is a growing need for high-thermal-conductivity adhesives that meet RoHs requirements.
NAMICS’ H9890 series is a pressure-less, low-temperature sintering silver paste combined with resin reinforcement and low-modulus technology. The result is a high thermal conductivity adhesive offering unmatched performance and world class reliability to meet the most demanding applications.
This novel technology provides a durable die-attach material with industry leading thermal and electrical conductivity for next generation power RF, power discrete, and power module packages. The robust formulation is compatible with standard die bonding equipment and offers outstanding manufacturability with long dispense life. Open times exceed six hours and staging times are up to 2 days for unrivaled flexibility on the production floor.
Unmatched workability designed for high-volume manufacturing and minimized downtime. The end result is an exceptional thermal conductive adhesive with flexibility in manufacturing process.
|High thermal conductivity||*||*|
|Bare copper compatible||*||*|
|Thermal conductivity||140 W/mK||60 W/mK||140 W/mK||60 W/mK|
|Modulus||17.0 GPa||6.0 GPa||13.5 GPa||6.5 GPa|
|Die shear strength||50 N/mm2||35 N/mm2||60 N/mm2||50 N/mm2|
Want to learn more about our Pressure-less Sintering Technology?