This novel technology provides a durable die-attach material with industry leading thermal and electrical conductivity for next generation power RF, power discrete and power module packages. The robust formulation is compatible with standard die bonding equipment and offers outstanding manufacturability with long dispense life, open times exceeding six hours and staging times up to 2 days for unrivaled flexibility on the production floor.
Unmatched workability designed for high volume manufacturing and minimizing downtime. End result is exceptional thermal conductive adhesive with flexibility in manufacturing process.
|High thermal conductivity||*||*|
|Bare copper compatible||*||*|
|Thermal conductivity||140 W/mK||60 W/mK||140 W/mK||60 W/mK|
|Modulus||17.0 GPa||6.0 GPa||13.5 GPa||6.5 GPa|
|Die shear strength||50 N/mm2||35 N/mm2||60 N/mm2||50 N/mm2|
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