Low Temperature Pressure-less Sintering
Our High Thermal Die Attach Solution is a great Solder replacement for die attach paste.
Low Temperature Pressure-less Sintering
Our High Thermal Die Attach Solution is a great Solder replacement for die attach paste.
NAMICS’ H9890 series is a pressure-less, low-temperature sintering silver paste combined with resin reinforcement and low-modulus technology.
The result is a high- thermal conductivity adhesive offering unmatched performance and reliability to meet the most demanding applications.
This novel technology provides a durable die attach material with industry-leading thermal and electrical conductivity for next generation power RF, power discrete and power module packages. The robust formulation is compatible with standard die bonding equipment. This material offers outstanding manufacturability with a long dispense life and unrivaled flexibility on the production floor.
NAMICS’ Pressure Silver Sintering Die Attach is a top choice for those in the power electronics industry who demand the best in die attach technology.
The result is a high- thermal conductivity adhesive offering unmatched performance and reliability to meet the most demanding applications.
This novel technology provides a durable die attach material with industry-leading thermal and electrical conductivity for next generation power RF, power discrete and power module packages. The robust formulation is compatible with standard die bonding equipment. This material offers outstanding manufacturability with a long dispense life and unrivaled flexibility on the production floor.
Replace Pb and AuSn solder with similar thermal conductivity
This novel technology provides a durable die-attach material with industry leading thermal and electrical conductivity for next generation power RF, power discrete, and power module packages. The robust formulation is compatible with standard die bonding equipment and offers outstanding manufacturability with long dispense life. Open times exceed six hours and staging times are up to 2 days for unrivaled flexibility on the production floor.
High Thermal Performance
Unmatched thermal and electrical conductivity
Superior Adhesive Strength
High reliability and performance at elevated temperatures
Best in Class Workability
Long open and staging times, continuous dispense for hours
Replace Pb and AuSn solder with similar thermal conductivity
This novel technology provides a durable die-attach material with industry leading thermal and electrical conductivity for next generation power RF, power discrete, and power module packages. The robust formulation is compatible with standard die bonding equipment and offers outstanding manufacturability with long dispense life. Open times exceed six hours and staging times are up to 2 days for unrivaled flexibility on the production floor.
High Thermal Performance
Unmatched thermal and electrical conductivity
Superior Adhesive Strength
High reliability and performance at elevated temperatures
Best in Class Workability
Long open and staging times, continuous dispense for hours
Formulated for long screen-printing life
- Simplifies the manufacturing process and reduces the production cost.
Offers temporary bonding and tack-free surface after drying
- Prevents movement during the transition to the downstream process
Excellent reliability
- Low resistivity due to high-thermal and electrical conductivity
- No change in junction temperature after 100,000 power cycles
Formulated for long screen-printing life
- Simplifies the manufacturing process and reduces the production cost.
Offers temporary bonding and tack-free surface after drying
- Prevents movement during the transition to the downstream process
Excellent reliability
- Low resistivity due to high-thermal and electrical conductivity
- No change in junction temperature after 100,000 power cycles
Download our Product Guide
Please complete the form to get an instant download of our sales sheet on Low Temperature Pressure-less Sintering.
Download our Product Guide
Please complete the form to get an instant download of our sales sheet on Low Temperature Pressure-less Sintering.