Board Level Underfill (BLUF)
These high Tg materials are used in various medical applications and can withstand high operating temperatures, which is critical in protecting solder connections from shock, drop and vibration.
Capillary Underfill for Wafer Level Package (WLP)
Narrow gap flow with low warpage and bump protection. Compatible with copper pillar
Glob Top & Encapsulants
Our encapsulant materials are designed to provide unmatched reliability, offering excellent moisture protection and heat resistance in medical devices.
Camera Module Adhesives
With flexible cure options and high dimensional stability, our camera module adhesive products offer unmatched reliability for critical medical applications.
