NAMICS’ Comittment to ‘Mutual Prosperity’
At NAMICS, our core philosophy is centered around “Mutual Prosperity,” or the harmonious co-existence between people and nature. Environmental protection and conservation are integral to every aspect of our business and production processes.
All NAMICS employees are trained in environmental education to raise awareness and emphasize our mission and “green” corporate philosophy.
Our global headquarters is located in Niigata-City, Japan, surrounded by plentiful agricultural fields, beautiful lagoons, and rivers that flow into the Sea of Japan.
Since our wastewater also flows through these rivers, it is our top priority to ensure that it is thoroughly cleaned in our state-of-the-art on-site wastewater purification facilities. We strictly adhere to all regulations and regularly test our emissions to prevent any air pollution in this natural location.
Solar farms and panels at several of our locations reduce energy costs and the burden on surrounding areas.
Recent facility improvements such as LED lighting, converting our company car fleet to hybrid vehicles, and optimizing shipping packages have significantly reduced waste and energy consumption.
Through the use of advanced technologies, we have established an aggressive plan to cut our carbon emissions by 46.2% by 2030 and become completely carbon neutral by 2050.
While NAMICS has led the way for 75 years in creating products that upgrade lives and cultures around the world, it is just as important for us to be a global leader in leaving our environment better than we found it.
To learn more about our company and culture, visit namics-corp.com.
our products
ADFLEMA (advanced flexible materials)
NAMICS’ ADFLEMA offers a comprehensive suite of solutions tailored to address the diverse needs of modern electronic applications.
Board Level Underfill (BLUF)
Designed to meet stringent requirements while re-workable for excellent reliability
Camera Module Adhesives
Our adhesives ensure optimal protection, effective heat dissipation, and robust bonding for a wide array of electronic components.
Capillary Underfill for Wafer Level Package (WLP)
Narrow gap flow with low warpage and bump protection. Compatible with copper pillar
Glob Top & Encapsulants
Outstanding adhesion to a wide variety of substrates, low CTE and high modulus for unmatched strength and robustness
Liquid Compression Molded Underfill (LCMUF)
Capable of wafer and panel level packaging, while highly productive due to fast cure cycle with minimal warpage after molding cure
Low temperature pressure-less sintering
NAMICS’ semiconductor packaging technology protects the die, connects the chip to a board or other chips, and may dissipate heat.
Low temperature Solder Glass Preforms
NAMICS’ semiconductor packaging technology protects the die, connects the chip to a board or other chips, and may dissipate heat.
Pressure sintering
From low-temperature sintering, to high-reliability and excellent printability, this material is a top choice for those who demand the best in die attach technology.
