NAMICS Corporation Earns Intel’s 2024 EPIC Distinguished Supplier Award
SAN JOSE, CA (MARCH 28, 2024) – NAMICS CORPORATION is proud to announce that it has earned Intel’s EPIC Distinguished Supplier Award. Through its dedication to Excellence, Partnership, Inclusion, and Continuous (EPIC) quality improvement, NAMICS has achieved a level of performance that consistently exceeds Intel’s expectations.
“As one of the 27 Distinguished Supplier Award recipients in 2024, NAMICS CORPORATION stands out among suppliers in Intel’s trusted supply chain,” said Keyvan Esfarjani, chief global operations officer at Intel. “Through their relentless drive to improve, they have achieved a level of performance that consistently exceeds Intel’s expectations and serves as a benchmark across the ecosystem.”
The Intel EPIC Distinguished Supplier Award recognizes a consistent level of strong performance across all performance criteria. Of the thousands of Intel suppliers around the world, only a few hundred qualify to participate in the EPIC Supplier Program. The EPIC Distinguished Award is the second-highest honor a supplier can achieve. In 2024, only 27 suppliers in the Intel supply chain network earned this award.
To qualify for an Intel EPIC Distinguished Supplier Award, suppliers must exceed expectations, meet aggressive performance goals, and score 80 percent or higher in performance assessments throughout the year. Suppliers must also meet 80 percent or more of their improvement plan deliverables and demonstrate formidable quality and business systems.
Get more information about the Intel EPIC Supplier Awards
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About NAMICS Technologies, Inc.
NAMICS is a global technology leader of advanced materials for semiconductor devices and packages, passive components, and solar cells. Headquartered in Niigata, Japan, NAMICS serves its worldwide customers with subsidiaries in the USA, Europe, Taiwan, Singapore, Korea, Hong Kong, and China. NAMICS has diverse product lines, including packaging and board level underfills, liquid molding compounds, glob top encapsulants, pressure-less sintering technology for die attach, adhesives for sensor and camera modules, and the latest generation of stretchable printed materials for interconnects, heating, and bonding on flexible substrates. NAMICS builds more than products; we build relationships.
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our products
ADFLEMA (advanced flexible materials)
NAMICS’ ADFLEMA offers a comprehensive suite of solutions tailored to address the diverse needs of modern electronic applications.
Board Level Underfill (BLUF)
Designed to meet stringent requirements while re-workable for excellent reliability
Camera Module Adhesives
Our adhesives ensure optimal protection, effective heat dissipation, and robust bonding for a wide array of electronic components.
Capillary Underfill for Wafer Level Package (WLP)
Narrow gap flow with low warpage and bump protection. Compatible with copper pillar
Glob Top & Encapsulants
Outstanding adhesion to a wide variety of substrates, low CTE and high modulus for unmatched strength and robustness
Liquid Compression Molded Underfill (LCMUF)
Capable of wafer and panel level packaging, while highly productive due to fast cure cycle with minimal warpage after molding cure
Low temperature pressure-less sintering
NAMICS’ semiconductor packaging technology protects the die, connects the chip to a board or other chips, and may dissipate heat.
Low temperature Solder Glass Preforms
NAMICS’ semiconductor packaging technology protects the die, connects the chip to a board or other chips, and may dissipate heat.
Pressure sintering
From low-temperature sintering, to high-reliability and excellent printability, this material is a top choice for those who demand the best in die attach technology.