NAMICS’ New Adhesive Enables Next-Generation, Flexible Hybrid Electronics
For over 70 years, NAMICS has been a global technology leader in advanced materials used in the manufacturing of semiconductor devices. We are excited to announce our newest product, H9230; a stretchable conductive adhesive. This new material is designed for flexible hybrid electronics, a new and exciting area in electronics which boasts both flexibility of lightweight and thin circuit boards, as well as the processing power of semiconductors.
What are Flexible Hybrid Electronics (FHE)?
Hybrid electronics are a growing area of the electronics industry, powered by increasing demand from consumers for more wearable and flexible products, as well as demands from industry to enable new applications. Flexible Hybrid Electronics have created a broad range of new applications across many industry segments, including the Internet of Things (IoT), smart buildings, healthcare, product packaging, retail, consumer electronics (including wearable devices), automotive, aerospace, and other emerging chip markets.
Specific applications of Flexible Hybrid Electronics include touch control, lighting, sensors, low-frequency wireless devices, and innovative signage, including solar-powered and flexible displays.
What Are the Benefits of NAMICS’ New Adhesive, H9230D for FHE?
H9230D is a new stretchable, conductive adhesive that is used to mount rigid components onto flexible hybrid substrates while providing an electrically conductive path. It was designed for attaching components such as LEDs, capacitors, and small chips to flexible substrates. New component attachment materials are needed for flexible electronic devices because they are mounted on soft, flexible substrates, and require materials to be ductile.
One challenge in the fabrication of FHE is temperature limitations, which mean that conventional soldering can damage the electrical components. Because the thin, low-cost substrates used in FHE are temperature-sensitive, soldering must be done in a way that allows for heat dissipation. This can add complexity to the FHE manufacturing process.
H9230D provides an ideal alternative to solder for FHE applications. While adhesives must be cured, the temperature requirements for affixing conductive adhesives are much lower than they are for soldering.
Other features of H9230D include:
Very low modulus, capable of 3x elongation compared to standard conductive adhesives
High adhesion strength at low temperatures (e.g., 70C for temperature-sensitive substrates, or snap-cured at 100C for 5 minutes).
Excellent reliability, withstanding temperature cycle and high humidity testing
Solvent-free, with very low shrinkage and no voiding
Designed for high volume manufacturing
Easy dispensing using standard equipment
Long pot life of 24 hours
NAMICS H9230D makes next-generation flexible hybrid electronics possible.
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our products
ADFLEMA (advanced flexible materials)
NAMICS’ ADFLEMA offers a comprehensive suite of solutions tailored to address the diverse needs of modern electronic applications.
Board Level Underfill (BLUF)
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Camera Module Adhesives
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Capillary Underfill for Wafer Level Package (WLP)
Narrow gap flow with low warpage and bump protection. Compatible with copper pillar
Glob Top & Encapsulants
Outstanding adhesion to a wide variety of substrates, low CTE and high modulus for unmatched strength and robustness
Liquid Compression Molded Underfill (LCMUF)
Capable of wafer and panel level packaging, while highly productive due to fast cure cycle with minimal warpage after molding cure
Low temperature pressure-less sintering
NAMICS’ semiconductor packaging technology protects the die, connects the chip to a board or other chips, and may dissipate heat.
Low temperature Solder Glass Preforms
NAMICS’ semiconductor packaging technology protects the die, connects the chip to a board or other chips, and may dissipate heat.
Pressure sintering
From low-temperature sintering, to high-reliability and excellent printability, this material is a top choice for those who demand the best in die attach technology.