NAMICS Receives TSMC Award for Technology Collaboration and Production Support
We are thrilled to announce that NAMICS has been recognized with the 2024 Excellent Technology Collaboration and Production Support Award from TSMC (Taiwan Semiconductor Manufacturing Company). This prestigious honor underscores our commitment to innovation, sustainability, and delivering exceptional results in advanced packaging technologies.
TSMC, the world’s largest dedicated semiconductor foundry, held its 2024 Supply Chain Management Forum under the theme “Empowering the Future with a Sustainable Semiconductor Ecosystem.” The event celebrated the contributions of outstanding supplier partners who have played pivotal roles in advancing TSMC’s technology leadership and global manufacturing capabilities.
During the forum, TSMC Chairman & CEO Dr. C.C. Wei and Senior Vice President and Deputy Co-COO Dr. Cliff Hou emphasized the importance of a resilient and innovative supply chain in shaping the future of technology. Breakout sessions and keynote speeches by renowned leaders in sustainability and AI highlighted the collective efforts needed to achieve progress while addressing environmental challenges.
The award presented to NAMICS recognizes our dedication to timely and high-quality production support, as well as our commitment to fostering innovation in advanced packaging—a critical area in semiconductor manufacturing. We are honored to be a part of TSMC’s mission to empower the future with sustainable and cutting-edge solutions.
We extend our heartfelt thanks to TSMC for this recognition and to our team for their hard work and collaboration. Together, we continue to push the boundaries of technology and innovation, ensuring a brighter and more connected future.
Stay tuned for more updates as we build on this achievement and drive excellence in advanced packaging technologies.
our products
ADFLEMA (advanced flexible materials)
NAMICS’ ADFLEMA offers a comprehensive suite of solutions tailored to address the diverse needs of modern electronic applications.
Board Level Underfill (BLUF)
Designed to meet stringent requirements while re-workable for excellent reliability
Camera Module Adhesives
Our adhesives ensure optimal protection, effective heat dissipation, and robust bonding for a wide array of electronic components.
Capillary Underfill for Wafer Level Package (WLP)
Narrow gap flow with low warpage and bump protection. Compatible with copper pillar
Glob Top & Encapsulants
Outstanding adhesion to a wide variety of substrates, low CTE and high modulus for unmatched strength and robustness
Liquid Compression Molded Underfill (LCMUF)
Capable of wafer and panel level packaging, while highly productive due to fast cure cycle with minimal warpage after molding cure
Low temperature pressure-less sintering
NAMICS’ semiconductor packaging technology protects the die, connects the chip to a board or other chips, and may dissipate heat.
Low temperature Solder Glass Preforms
NAMICS’ semiconductor packaging technology protects the die, connects the chip to a board or other chips, and may dissipate heat.
Pressure sintering
From low-temperature sintering, to high-reliability and excellent printability, this material is a top choice for those who demand the best in die attach technology.