NTI announces new CEO Tatsuhiro Fujiki
NAMICS Technologies, Inc. has proudly welcomed Mr. Tatsuhiro Fujiki to its esteemed team as the newly appointed Chief Executive Officer. Mr. Fujiki brings with him more than 40 years of invaluable experience at NAMICS Corporation, where he has consistently demonstrated his prowess in driving robust business growth, spearheading strategic operational initiatives, and delivering enhanced results.
In his most recent role as Director of Sales Division at NAMICS Corporation, Mr. Fujiki played a pivotal role in providing cutting-edge packaging and electronic material solutions to a global clientele. His extensive knowledge of the business and profound understanding of the company’s materials makes him an unparalleled asset to the NTI team.
Brian Schmaltz, Chief Operating Officer, expressed his enthusiasm for Mr. Fujiki’s arrival, emphasizing the unparalleled expertise and leadership skills that he brings to the table. “Given the significant growth and expansion experienced by the company in previous years, I’m confident that Mr. Fujiki’s industry background aligns perfectly with the company’s trajectory, positioning NTI for continued success,” said Schmaltz.
Mr. Fujiki’s career trajectory reflects a commitment to excellence, having graduated from The Department of Chemical Engineering at Niigata University. With two decades dedicated to the development of insulating encapsulants, he later transitioned to marketing and sales, where he played a key role in the development and sales of encapsulants for LCD driver integrated circuits and underfill material for flip chip packaging. The addition of Mr. Fujiki as CEO marks an exciting chapter for NAMICS Technologies, Inc. as it continues to evolve and thrive in the dynamic landscape of advanced materials manufacturing.
NAMICS Corporation, a global leader in the manufacturing of advanced materials for semiconductor devices and packages, boasts a diverse range of material offerings catering to industries such as consumer electronics, medical devices, automotive, power devices, and aerospace. The company is steadfast in its commitment to social and environmental responsibility, prioritizing sustainable growth while upholding unwavering corporate values.
our products
ADFLEMA (advanced flexible materials)
NAMICS’ ADFLEMA offers a comprehensive suite of solutions tailored to address the diverse needs of modern electronic applications.
Board Level Underfill (BLUF)
Designed to meet stringent requirements while re-workable for excellent reliability
Camera Module Adhesives
Our adhesives ensure optimal protection, effective heat dissipation, and robust bonding for a wide array of electronic components.
Capillary Underfill for Wafer Level Package (WLP)
Narrow gap flow with low warpage and bump protection. Compatible with copper pillar
Glob Top & Encapsulants
Outstanding adhesion to a wide variety of substrates, low CTE and high modulus for unmatched strength and robustness
Liquid Compression Molded Underfill (LCMUF)
Capable of wafer and panel level packaging, while highly productive due to fast cure cycle with minimal warpage after molding cure
Low temperature pressure-less sintering
NAMICS’ semiconductor packaging technology protects the die, connects the chip to a board or other chips, and may dissipate heat.
Low temperature Solder Glass Preforms
NAMICS’ semiconductor packaging technology protects the die, connects the chip to a board or other chips, and may dissipate heat.
Pressure sintering
From low-temperature sintering, to high-reliability and excellent printability, this material is a top choice for those who demand the best in die attach technology.
