Industries we serve

Semiconductor Packaging

Industries we serve

Semiconductor Packaging

Semiconductor packaging has become essential on every level to the semiconductor design. It affects power, performance, and cost on a macro level, and the basic functionality of all chips on a micro level.

Semiconductor packaging technology protects the die, connects the chip to a board or other chips, and may dissipate heat. Demand for today’s semiconductor packaging is pushing towards heterogeneous integration of different devices and technologies.

The goal is for next generation modules to offer improved performance with lower power consumption while moving towards miniaturization. Learn more below about NAMICS’ diverse suite of innovative solutions to handle these challenges.

Semiconductor Packaging

Semiconductor packaging has become essential on every level to the semiconductor design. It affects power, performance, and cost on a macro level, and the basic functionality of all chips on a micro level.

Semiconductor packaging technology protects the die, connects the chip to a board or other chips, and may dissipate heat. Demand for today’s semiconductor packaging is pushing towards heterogeneous integration of different devices and technologies.

The goal is for next generation modules to offer improved performance with lower power consumption while moving towards miniaturization. Learn more below about NAMICS’ diverse suite of innovative solutions to handle these challenges.

Semiconductor Packaging

Semiconductor Packaging

NAMICS PRODUCTS

Semiconductor Packaging

NAMICS PRODUCTS

Semiconductor Packaging

Capillary Underfill for Wafer Level Package (WLP)

Narrow gap flow with low warpage and bump protection. Compatible with copper pillar

Semiconductor Packaging

Board Level Underfill (BLUF)

Designed to meet stringent automotive requirements while reworkable for excellent reliability

Semiconductor Packaging

Liquid Compression Molded Underfill (LCMUF)

Capable of wafer and panel level packaging, while highly productive due to fast cure cycle with minimal warpage after molding cure

Semiconductor Packaging

Glob Top & Encapsulants

Outstanding adhesion to a wide variety of substrates, low CTE and high modulus for unmatched strength and robustness

Learn more about the industries our next-generation technology supports.

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Our products are utilized in automotive technology you use everyday.

Our products are utilized in automotive technology you use everyday.