Streamline Your Semiconductor Supply Chain with NAMICS

In today’s global electronics industry, maintaining a streamlined, low-risk supply chain is more important than ever.
 
One of the biggest obstacles in the global electronics industry is maintaining an efficient and streamlined supply chain with reduced risk. Procuring materials for semiconductor fabrication introduces many challenges, such as complex import processes due to chemical management, shifting global economic policies, obtaining material certifications, and adhering to government regulations. NAMICS Corporation offers a hassle-free partnership through streamlined shipping and attentive customer service. Not only do we provide solutions to your application needs, but to your supply chain too.
 
US Based Operations
While NAMICS Corporation manufactures underfill materials in Japan, NAMICS Technologies, Inc., is a US-based company with distribution in Carson City, NV. All imports are managed internally to clear customs and reduce the customer’s liability. NAMICS provides lead times of 4-6 weeks, which is faster than the industry average, and direct domestic shipments. Board level applications like BGAs and CSPs are challenging enough, and NAMICS provides direct purchasing to create a simpler process.
 
Uninterrupted Support
NAMICS customer service and sales support are also based out of the United States. Any questions regarding materials or shipment information are quickly answered. Sales support is nationwide with highly trained local representatives based in Massachusetts, Arizona, California, North Carolina, and Florida. NAMICS seeks to provide continuous support for your applications by avoiding varying time zones.
 
Highest Quality Standards
NAMICS Corporation has been privately owned and operated with manufacturing and engineering in Niigata, Japan for more than 75 years. Nature, art, mutual prosperity, innovation, creativity, and sensitivity are the foundations of our culture, leading to the highest quality underfills available on the market. Our manufacturing and engineering team in Japan are dedicated to maintaining the highest standards of reliability. Fast flow properties, fine pitch and gap compatibility, low warpage, and excellent dispensability are features that NAMICS provides to meet increasingly demanding underfill applications.
 
Learn More Today
Contact your local sales team to learn more about NAMICS’ low minimum order requirements and underfill samples for evaluation. Our experts are available to discuss your application. Click here.

our products

printed circuit board with advanced processing unit

ADFLEMA (advanced flexible materials)

NAMICS’ ADFLEMA offers a comprehensive suite of solutions tailored to address the diverse needs of modern electronic applications.

Streamline Your Semiconductor Supply Chain with NAMICS

Board Level Underfill (BLUF)

Designed to meet stringent requirements while re-workable for excellent reliability 

Streamline Your Semiconductor Supply Chain with NAMICS

Camera Module Adhesives

Our adhesives ensure optimal protection, effective heat dissipation, and robust bonding for a wide array of electronic components.  

Streamline Your Semiconductor Supply Chain with NAMICS

Capillary Underfill for Wafer Level Package (WLP)

Narrow gap flow with low warpage and bump protection. Compatible with copper pillar

Streamline Your Semiconductor Supply Chain with NAMICS

Glob Top & Encapsulants

Outstanding adhesion to a wide variety of substrates, low CTE and high modulus for unmatched strength and robustness

Streamline Your Semiconductor Supply Chain with NAMICS

Liquid Compression Molded Underfill (LCMUF)

Capable of wafer and panel level packaging, while highly productive due to fast cure cycle with minimal warpage after molding cure

Streamline Your Semiconductor Supply Chain with NAMICS

Low temperature pressure-less sintering

NAMICS’ semiconductor packaging technology protects the die, connects the chip to a board or other chips, and may dissipate heat. 

Streamline Your Semiconductor Supply Chain with NAMICS

Low temperature Solder Glass Preforms

NAMICS’ semiconductor packaging technology protects the die, connects the chip to a board or other chips, and may dissipate heat. 

Streamline Your Semiconductor Supply Chain with NAMICS

Pressure sintering

From low-temperature sintering, to high-reliability and excellent printability, this material is a top choice for those who demand the best in die attach technology.